The simulated interconnection USES a mixture of copper and silver solid OCC conductor (Ohno continuous casting). The total cross section of each channel is 2.06 mm ^ 2 (1.03 mm ^ 2 for each path). Carefully select the ratio of silver to copper and the diameter of the single wire to provide the best performance.

A braided soft packing around the two wire bundles creates mechanical damping and spacing, which is then twisted together to reduce noise. The resulting low capacitance will produce a sound called uplift.

Special dissipated carbon screens are used to shield EMI/RFI. It is not connected to the connector pin to avoid interference with access to the signal. Instead, the screen is connected to an external 4mm female banana plug, which can be independently grounded (case or ground). The carbon shield also helps dissipate the static charge accumulated over time in the cable material.

Even without an external ground, a floating screen can significantly reduce noise without having the same negative impact on sound as a traditional metal shield.

You get the best results if you connect the screen to CAD Ground Control of Computer Audio Design. This enhances the sense of stillness and clarity of the sound.

The connectors are ETI Research's Kryo XLR and WBT 0152 NextGen Silver RCA. The interconnection length starts at 1 meter and the step length is 50 cm.